ROYCE INSTRUMENTS

DE22

System 130

DE35-ST

The Royce Instruments DE-35 is a semi-automatic die pick and place system used in the semiconductor industry. It is available for up to 200mm dia wafers standard, 300mm wafers special order and has a throughput of 700 to 1200 UPH, application dependent. The DE-35 has quick change multi-needle eject heads and an output stage for waffle packs, Gel-Paks, film frames etc. Options include non-surface contact die picking, die inverter, die underside inspection and high magnification die facet (edge) inspection.

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DE-35

DE35-ST

System 130

DE22

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