说明
无说明配置
Frame is a AMAT Centura II Hybrid with 3 process chambers CENTURA 5200 IPS and one EMAX process chamber.OEM 型号描述
Etch system delivers high-productivity silicon, metal, and dielectric etch. The Centura and Centura AP mainframe single-wafer, multi-chamber architectures enable integrated, sequential wafer processing in up to four process chambers for 150mm, 200mm, and 300mm wafers. For 150/200mm wafers, Applied Centura DPS® DTM system employs advanced deep reactive ion etch (DRIE) for a range of materials to precisely control etch wall smoothness and trench profile, while delivering high aspect ratio capability and achieving high throughput. Applied Centura DPS Plus is the industry standard for metal etch processes.文件
无文件
APPLIED MATERIALS (AMAT)
CENTURA 5200 IPS
已验证
类别
Plasma Etch
上次验证： 18 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
103686
晶圆尺寸：
未知
年份：
2002
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
APPLIED MATERIALS (AMAT)
CENTURA 5200 IPS
类别
Plasma Etch
上次验证： 18 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
103686
晶圆尺寸：
未知
年份：
2002
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
Frame is a AMAT Centura II Hybrid with 3 process chambers CENTURA 5200 IPS and one EMAX process chamber.OEM 型号描述
Etch system delivers high-productivity silicon, metal, and dielectric etch. The Centura and Centura AP mainframe single-wafer, multi-chamber architectures enable integrated, sequential wafer processing in up to four process chambers for 150mm, 200mm, and 300mm wafers. For 150/200mm wafers, Applied Centura DPS® DTM system employs advanced deep reactive ion etch (DRIE) for a range of materials to precisely control etch wall smoothness and trench profile, while delivering high aspect ratio capability and achieving high throughput. Applied Centura DPS Plus is the industry standard for metal etch processes.文件
无文件