Semiconductor manufacturing equipment: Probing machines, Dicing machines, Precision Blade, Polish grinders, Chemical mechanical planarizers (CMPs), Wafer slicing machines*, Wafer edge grinding machines*
Measuring instruments: Coordinate measuring machines, Surface texture and contour measuring instruments, Roundness and cylindrical profile measuring instruments, Optical measuring instrument, Machine control gauges*, Various types of sensors*

ACCRETECH / TOSEI

W-GM-4250 is a Wafer Edge Grinding Machine from the W-GM series by TOSEI ENGINEERING CORP. It has 2 grinding stages with a 4-cassette loader and is capable of grinding various materials such as Silicon, Sapphire and compound materials such as SiC. It is designed for easy operation by touch screen and graphical user interface. The W-GM-4250 is part of the W-GM-4200 Series and is designed for 2" to 8" wafer production.

ACCRETECH / TOSEI

W-GM-4250

Wafer Grinding

类似上架物品

ACCRETECH / TOSEI

W-GM-4250

ACCRETECH / TOSEI

W-GM-4250

W-GM-4250

Wafer Grinding

类似上架物品

ACCRETECH / TOSEI

W-GM-4250

ACCRETECH / TOSEI

W-GM-4250