说明
无说明配置
Loader Port: 2 Ports Robot Arm: Dual (U Arm) Aligner: Position Table (12" & 13") Wafer Warpage: 4mm Spindle: Z1 & Z2 Spindle Height Guage: Wafer Thickness Check During Grinding Chuck Table: CHUCK A, B, C System: Win EmbeddedOEM 型号描述
The Disco DFG8560 is a Fully Automatic In-Feed Surface Grinder that supports advancements for thinner and larger wafers up to Φ300 mm. It is the successor to the DFG800 series and has inherited grinding specifications with an established reputation1. The equipment weight has been reduced by 1.0 t (20% less than DFG860) while maintaining the same basic specifications and performance level as the 800 series.文件
无文件
DISCO
DFG8560
已验证
类别
Polishing and Grinding
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
15188
晶圆尺寸：
12"/300mm
年份：
2016
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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DISCO
DFG8560
已验证
类别
Polishing and Grinding
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
15188
晶圆尺寸：
12"/300mm
年份：
2016
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
Loader Port: 2 Ports Robot Arm: Dual (U Arm) Aligner: Position Table (12" & 13") Wafer Warpage: 4mm Spindle: Z1 & Z2 Spindle Height Guage: Wafer Thickness Check During Grinding Chuck Table: CHUCK A, B, C System: Win EmbeddedOEM 型号描述
The Disco DFG8560 is a Fully Automatic In-Feed Surface Grinder that supports advancements for thinner and larger wafers up to Φ300 mm. It is the successor to the DFG800 series and has inherited grinding specifications with an established reputation1. The equipment weight has been reduced by 1.0 t (20% less than DFG860) while maintaining the same basic specifications and performance level as the 800 series.文件
无文件