说明
无说明配置
OCR: Yes Wafer specification Size: 8"/12" Thickness: 240~750um Wafer size: 200mm~300mm Autoloader unit 300 mm FOUP/ FOSB and 200 mm cassette Single port Loader Interface GPIB Chuck Nickel plate Planarity : 15um (20℃≦t ≦50℃) 30um (50℃≦t ≦200℃) Temperature : 25℃ to 150℃ Withstand Load : 200kgf Display Unit: 15” color display & touch panel Cleaning Unit (100 mm x 60mm) 3 block with vacuum type APC function No Miscellaneous 1. Touch sensor. 2. Ethernet interface. 3. Cognex 8200 Docking interface VLCT Auto hinge No Probe card holder No Touch sensor YesOEM 型号描述
The UF3000 is a fully automatic, ultra-high function probing machine developed by ACCRETECH / TSK to be the de facto standard model for the semiconductor testing process. It meets a wide range of customer requirements, including high-mix low-volume production for System LSI and mass production for memories. The machine has received high evaluation from major device manufacturers in terms of CoO (Cost of Ownership) and OEE (Overall Equipment Efficiency).文件
无文件
类别
Probers
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
131882
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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ACCRETECH / TSK
UF3000
类别
Probers
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
131882
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
OCR: Yes Wafer specification Size: 8"/12" Thickness: 240~750um Wafer size: 200mm~300mm Autoloader unit 300 mm FOUP/ FOSB and 200 mm cassette Single port Loader Interface GPIB Chuck Nickel plate Planarity : 15um (20℃≦t ≦50℃) 30um (50℃≦t ≦200℃) Temperature : 25℃ to 150℃ Withstand Load : 200kgf Display Unit: 15” color display & touch panel Cleaning Unit (100 mm x 60mm) 3 block with vacuum type APC function No Miscellaneous 1. Touch sensor. 2. Ethernet interface. 3. Cognex 8200 Docking interface VLCT Auto hinge No Probe card holder No Touch sensor YesOEM 型号描述
The UF3000 is a fully automatic, ultra-high function probing machine developed by ACCRETECH / TSK to be the de facto standard model for the semiconductor testing process. It meets a wide range of customer requirements, including high-mix low-volume production for System LSI and mass production for memories. The machine has received high evaluation from major device manufacturers in terms of CoO (Cost of Ownership) and OEE (Overall Equipment Efficiency).文件
无文件