Cohu acquires Xcerra, adding LTX-Credence Testers, Multitest test handlers and contactors and Everett Charles Technology (ECT) pogo spring probes to the portfolio.

A next-generation system for transistor-level backside analysis of complex IC designs with both flip-chip and wire bond packaging technologies. Featuring a new Solid Immersioin Lens (SIL), EmiScope-II provides an industry-leading sub-0.25 micron image resolution and enhanced data acquisition rate to enable analysis of device performance at the critical node level. The system’s high-speed acquisition and data processing capabilities enable semiconductor manufacturers to quickly perform design debug, failure analysis and characterization, improving time-to-market and lowering device development costs.

COHU / LTX-CREDENCE

EMISCOPE-II

The EmiScope-I-GP extends time-resolved emission capability to devices packaged with wire bond and tape automated bonding technologies. Featuring a long working distance objective to accommodate the needs of traditional packaging, the system enables probing in a variety of load board and package configurations.

EMISCOPE-I-GP

A configurable, expandable platform for non-invasive, transistor-level internal signal probing of silicon ICs. The EmiScope-IIt is the industry-leading solution for debug of flip-chip packaged and multi-metal layer devices. Using innovative time-resolved photon emission detection technology, the system enables semiconductor manufacturers to perform debug and characterization more quickly and effectively, thus bringing products to market faster, with fewer design respins. The system’s high-bandwidth electronics, high-resolution imaging, and data management capabilities enable semiconductor manufacturers to perform timely design debug, failure analysis and characterization. The EmiScope-IIt offers multiple user options, including five lens sets for a variety of package types, high-power cooling, flexible fixturing and software data analysis modules. The EmiScope-IIt can also be field upgraded with GlobalScan technology as customer needs grow.

EMISCOPE-IIt

PANTHER is a prober that optimizes test and vision inspection of wafer level package (WLP) and bumped dies, delivering a substantial improvement in semiconductor manufacturing quality that is required for today’s high-end consumer products.

PANTHER

An industry-leading solution for backside timing measurement of flip-chip packaged and complex multi-metal layer devices, the EmiScope-I provides interactive tools to perform transistor level timing measurements in the engineering, debug and failure analysis environments. Using innovative time-resolved emission technology, the system enables semiconductor manufacturers to bring products to market faster, at a lower cost, and accelerate failure analysis problem resolution.

COHU / LTX-CREDENCE

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EMISCOPE-II

EMISCOPE-I-GP

EMISCOPE-IIt

PANTHER

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