概述

High-performance solution for on-wafer applications, offering RF measurements up to 67 GHz and broadband integration up to 220 GHz. Ideal for RF, DC, and high-power testing (up to 10 kV/400 A), it ensures 24/7 production reliability with safety interlocks. Ergonomically designed for seamless wafer handling, supporting up to 200 mm wafers and advanced optics for precise alignment. Compatible with thermal chucks (20–300 °C) and thin wafer handling down to 50 µm. Experience unparalleled accuracy and efficiency in semiconductor testing.