概述

Feature: Application for wafer size : 8”~12” Contact accuracy: ±1㎛ (Advanced motion control technology) Improvement of Loading Accuracy (Wafer change and align time reduction) Stiffness Z-axis (1,000 kgf) Precision temperature control (4℃@2,000W) Application of auto leveling / securing the stability of contact (10㎛) Self-diagnosis system (Life prediction, Pre-detection) Auto card change (Side/front auto card change) Advanced wafer & card automation (RGV, OHT, AGV)