概述

NanoCLP 9010 optical laser profiler for copper metal loss measurement. The first product offered in the series is the NanoCLP 9010 is a laser-based, optical profiling and reflectance measurement system that incorporates the newly developed Copper Laser Profiler (CLP) technology for the measurement of copper metal loss during chemical mechanical planarization on semiconductor wafers and is designed for integration into semiconductor wafer processing equipment. The system also incorporates our unique 300 millimeter edge-gripping wafer stage with an integral pre-aligner.