说明
无说明配置
Load lock: function normal CHE/CHF (TC type) no laser gun, CCD PCB, ORIENT PCB CHA/B function normal CH-1 CH2 (wide body) standard heater, G12 magnet function normal CH-3 CH-4 Buffer function normal XFER (VHP robot) function normal Main AC rack System rack function normal System rack function normal RF rack COMET GEN*1 , ENNER STREAM S*3, AE PINNACLE*1 Compressor, Neslab function normalOEM 型号描述
AMAT leveraged its expertise in single-wafer, multichamber architecture to develop an evolutionary platform called the Endura 5500 PVD (physical vapor deposition) in 1990 featuring a staged, ultra-high vacuum architecture for the rapid sputtering of aluminum and other metal films used to form the circuit interconnections on advanced devices.文件
无文件
APPLIED MATERIALS (AMAT)
ENDURA 5500
已验证
类别
PVD / Sputtering
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
107897
晶圆尺寸：
8"/200mm
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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APPLIED MATERIALS (AMAT)
ENDURA 5500
类别
PVD / Sputtering
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
107897
晶圆尺寸：
8"/200mm
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
Load lock: function normal CHE/CHF (TC type) no laser gun, CCD PCB, ORIENT PCB CHA/B function normal CH-1 CH2 (wide body) standard heater, G12 magnet function normal CH-3 CH-4 Buffer function normal XFER (VHP robot) function normal Main AC rack System rack function normal System rack function normal RF rack COMET GEN*1 , ENNER STREAM S*3, AE PINNACLE*1 Compressor, Neslab function normalOEM 型号描述
AMAT leveraged its expertise in single-wafer, multichamber architecture to develop an evolutionary platform called the Endura 5500 PVD (physical vapor deposition) in 1990 featuring a staged, ultra-high vacuum architecture for the rapid sputtering of aluminum and other metal films used to form the circuit interconnections on advanced devices.文件
无文件