The Apollo 300 is a wafer sputtering tool from ASMPT NEXX. It is used for PVD 200-300 mm wafer processing and can be configured for up to 5 metals. It has applications in UBM/RDL, Fan Out, RF Filters, and Power Devices. It has a true bridge tool capability with size change, degas/anneal, and ICP/CCP etch. It can process 200 and 300 mm wafers including warped and heavy wafers made of silicon, EMC, RCP, glass, and bonded.

NEXX Systems found in 2001. In 2012 Tokyo Electron acquired NEXX and renamed it TEL NEXX, Inc. In 2018 ASMPT acquired the company and renamed it ASM NEXX, Inc.
ASM NEXX is a worldwide leading supplier of metallization Advanced Packaging Deposition Equipment specializing in sputtering (PVD) and plating (ECD) processes.

APOLLO 300

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