概述

The Apollo 300 is a wafer sputtering tool from ASMPT NEXX. It is used for PVD 200-300 mm wafer processing and can be configured for up to 5 metals. It has applications in UBM/RDL, Fan Out, RF Filters, and Power Devices. It has a true bridge tool capability with size change, degas/anneal, and ICP/CCP etch. It can process 200 and 300 mm wafers including warped and heavy wafers made of silicon, EMC, RCP, glass, and bonded.