EC7001
概述
System configuration: Cluster-type (EC7000 sputtering chamber ×1, EC7001 sputtering chamber ×2) Tray transport method Substrate size: φ200mm maximum Cathode: φ4" cathode ×3 (Option: φ12.5" cathode ×1, φ4" cathode ×4) Operation method: Fully automated (pumping, transport, deposition)
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