说明
TFM_TiN-HM Dep配置
TFM_TiN-HM DepOEM 型号描述
The INOVA NExT, a 300mm metallization system designed to deposit highly conformal copper barrier-seed films at 45 nanometers and beyond. On the INOVA NExT, the single target HCM technology has been extended to the 45 nanometer node; the system also features an integrated ion-induced atomic layer deposition (iALD) module to deposit tantalum nitride (TaN) barrier films below 45 nanometers.文件
无文件
LAM RESEARCH / NOVELLUS
INOVA NExT
已验证
类别
PVD / Sputtering
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
49104
晶圆尺寸：
12"/300mm
年份：
2013
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
LAM RESEARCH / NOVELLUS
INOVA NExT
类别
PVD / Sputtering
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
49104
晶圆尺寸：
12"/300mm
年份：
2013
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
TFM_TiN-HM Dep配置
TFM_TiN-HM DepOEM 型号描述
The INOVA NExT, a 300mm metallization system designed to deposit highly conformal copper barrier-seed films at 45 nanometers and beyond. On the INOVA NExT, the single target HCM technology has been extended to the 45 nanometer node; the system also features an integrated ion-induced atomic layer deposition (iALD) module to deposit tantalum nitride (TaN) barrier films below 45 nanometers.文件
无文件