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说明
无说明配置
ATV Technologie SRO 702 IR Vacuum Reflow Brazing RTA. The perfect soldering systems, solder reflow ovens (SRO) with rapid thermal annealing and brazing capability are IR lamp heated multi-purpose cold wall process ovens. The SRO is ideal for R&D, process development as well for low to high volume production. Die attachment, IGBT/DBC, high vacuum encapsulation, MEMS package sealing, IR sensor/Crystal package sealing, wafer level packaging, thermo electric cooler/Peltier, low moisture package sealing, high power LED, laser bar, Getter activation, alloying, wafer bump/solder ball reflow, pin fin heat sink, backing, flip chip, 3 D-CSP, diffusion bonding, CPV, thermo compression bonding, pin fins, Hybrid assembly, MMIC die attachment, power modules, electric vehicle controls, power solar cells. Temperature: up to 1100 deg C. Fast heated plate ramping. Ramping up greater than 3.5 deg C/sec. Ramping down greater than 2 deg C/sec. Rapid single wafer processing greater than 50 deg C/sec. Heated Area: 147 x 217mm. 208V, 3 Ph, 60 Hz, 25A, CE.OEM 型号描述
未提供文件
无文件
PREFERRED
SELLER
类别
Reflow Oven
上次验证： 60 多天前
Buyer pays 12% premium of final sale price
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
17653
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
PREFERRED
SELLER
ATV TECHNOLOGY
SRO 704
类别
Reflow Oven
上次验证： 60 多天前
Buyer pays 12% premium of final sale price
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
17653
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
ATV Technologie SRO 702 IR Vacuum Reflow Brazing RTA. The perfect soldering systems, solder reflow ovens (SRO) with rapid thermal annealing and brazing capability are IR lamp heated multi-purpose cold wall process ovens. The SRO is ideal for R&D, process development as well for low to high volume production. Die attachment, IGBT/DBC, high vacuum encapsulation, MEMS package sealing, IR sensor/Crystal package sealing, wafer level packaging, thermo electric cooler/Peltier, low moisture package sealing, high power LED, laser bar, Getter activation, alloying, wafer bump/solder ball reflow, pin fin heat sink, backing, flip chip, 3 D-CSP, diffusion bonding, CPV, thermo compression bonding, pin fins, Hybrid assembly, MMIC die attachment, power modules, electric vehicle controls, power solar cells. Temperature: up to 1100 deg C. Fast heated plate ramping. Ramping up greater than 3.5 deg C/sec. Ramping down greater than 2 deg C/sec. Rapid single wafer processing greater than 50 deg C/sec. Heated Area: 147 x 217mm. 208V, 3 Ph, 60 Hz, 25A, CE.OEM 型号描述
未提供文件
无文件