说明
无说明配置
Sikama Falcon Five Multi-Purpose Reflow Soldering System. Substrate materials: ceramics, glass, epoxy, paper based phenolic flex circuits, green tape, silicon wafers and porcelainized materials. Can be used as a linear oven for curing and drying applications or as a solder reflow system. Achieves rapid cure times with excellent adhesion and low volume resistivity in conductor materials. Three controlled heating zones. Max. Temp.: 400 deg C. Max. Substrate Size: 5 in. x 5.5 in. 120V, 50/60 Hz, 20A.OEM 型号描述
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SIKAMA
FALCON 8500
已验证
类别
Reflow Oven
物品主要详细信息
状况:
Used
运行状况:
未知
产品编号:
16755
晶圆尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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FALCON 8500
已验证
类别
Reflow Oven
上次验证: 60 多天前
物品主要详细信息
状况:
Used
运行状况:
未知
产品编号:
16755
晶圆尺寸:
未知
年份:
未知
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
Sikama Falcon Five Multi-Purpose Reflow Soldering System. Substrate materials: ceramics, glass, epoxy, paper based phenolic flex circuits, green tape, silicon wafers and porcelainized materials. Can be used as a linear oven for curing and drying applications or as a solder reflow system. Achieves rapid cure times with excellent adhesion and low volume resistivity in conductor materials. Three controlled heating zones. Max. Temp.: 400 deg C. Max. Substrate Size: 5 in. x 5.5 in. 120V, 50/60 Hz, 20A.OEM 型号描述
未提供文件
无文件