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WS-Evo
概述
12” wafer ring to 12” wafer ring high speed reconstruction machine with vision inspection for WLCSP, KGD(Known Good Die), and image sensor on a 12” wafer. 24,000 UPH high productivity. 6S-vision inspection (IR option). Cleanroom class 100 compliant.
活动的上架物品
2
服务
检验、保险、评估、物流
