High Performance, Semi-Automated SMT Rework. Semi-automated and repeatable thermal performance with highly accurate vision alignment.

AIR-VAC

DRS25

Fully automated precision control high speed force feedback provides sensitivity for delicate placement.

AVX1000

PCBRM

PHS1500

The PCBRM15 is the current module for lead-free through hole rework and selective soldering. The system includes a long lasting solder pot and pumping system with temperature and process for repeatable results.

PCBRM15

Large, high thermal mass assemblies. Next generation solder fountain technology. Focused convective heating, EZ alignment.

PCBRM100

The PCBRM2 printed circuit board reflow module was introduced in 1971 and made it possible to reflow multiple through-hole leads simultaneously using molten solder.

PCBRM2

The DRS24C provided automated process controlled rework capabilities for a wide range of packaging and assembly designs. The DRS24C became an Industry Standard.

DRS24C

ONYX29

Large thermally challenging assemblies processed with powerful heating and multiple filed of view vision.

DRS27

The PCBRM System 5.2 module was introduced to meet increased production requirements an to meet the needs of thermally challenging assemblies using a preheated, motorized carrier, and process control software.

PCBRM System 5.2

AVX1000M General Specifications:
• Maximum Board Size: 24" x 32"
• Machine Dimensions: 40"W x 40"D x 65"H
• Enclosure Dimensions: 50"W x 50"D x 70"H

AVX1000M

AVX250 General Specifications:
• Maximum Board Size: 10" x 18"
• Machine Dimensions: 36"W x 34"D x 41"H
• Enclosure Dimensions: 46"W x 52"D x 54"H

AVX250

The DRS22 Beam-Splitter Reword System used for components such as BGA's, Connectors, etc.

AIR-VAC

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