概述

Radiance Centura has been ergonomically designed. Each chamber has its own gas panel and the gas panel has been relocated to its current position below the chamber to make it more accessible. Radiance Centura 300mm chamber is available for atmospheric pressure and reduced pressure processing. Rurming the Radiance chamber at reduced pressure is usefiil for systems that have a LPCVD and RTP chamber on the same mainframe because it saves the total production time by reducing the time spent pumping up and down the transfer chamber between wafers. Centura Radiance™ is a production proven process tool of record for the 0.13µm node in various wafer fabrication facilities across the world. Typical temperature – time performance in the Centura Radiance™ chamber.