概述

The Heatpulse 8800i and 8108i enable chipmakers to achieve significant savings in facility costs by combining the RTP system and Asyst's SMIF-Enclosure mini-environment into one integrated system, thereby reducing total system footprint, while increasing overall fab cleanliness. The Heatpulse 8800i and 8108i utilize the company's patented cross lamp oven and individual zone control to generate temperature uniformity. Both systems address the parameters for process repeatability, slip-free processing, and contamination control.