概述

Alignment accuracy: > 2.0 Cmk @ ±12.5 μm, (6 sigma)* Machine capability: > 2.0 Cmk @ ±25 μm, (6 sigma)** Shortest core cycle time (CCT): 11 seconds (8 seconds with option) Operating system: Windows 7 Standard embedded Squeegee pressure: Software-controlled, motorized with closed-loop feedback Stencil positioning: Depth stop or semi-automatic stencil loading Adjustable-width stencil mount: Variable stencil width adjustment for frame sizes ranging from 381 mm to 736 mm and thicknesses ranging from 25 mm to 38 mm Understencil cleaning: DEK Interchangeable Under Stencil Cleaner (DEK IUSC) with programmable wet, dry and vacuum cleaning Substrate size: 50 mm (X) x 40.5 mm (Y) to 510 mm (X) x 508.5 mm (Y) Substrate thickness: 0.2 mm to 6 mm Substrate weight: Up to 6 kg Program creation: Less than 10 minutes Substrate clamping: Over-the-top clamping, Edge clamping (optional), Vacuum (optional) Temperature and humidity sensors: Statistical recording of temperature and humidity readings Paste verification: Hawkeye 750 (optional)