Wafer Printing Cell The Compact Solution for Wafer Printing. The flexible machining cell is designed for front or back side printing (bumping or wafer backside coating) on round wafers. The system consists of two main modules, a loading unit and a printing system. The loading unit in turn consists of three components: a magazine unloading system, a robot unit and a pre-align station. 

With the EKRA brand we offer scalable printing systems for your electronics production. With stencil and screen printers, you can apply solder paste to printed circuit boards precisely and with repeatable accuracy. 

HYCON XW

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