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概述
With two parallelly arranged diamond precision cutting discs. Machine is suitable for squaring mono crystalline ingots with of work piece diameter of 150 - 230 mm (wafer format 125 x 125 mm or 156 x 156 mm). Segment lengths of 200 – 2500 mm can be processed. With water hydraulic guidance for thin diamond cutting discs as well as cutting force and automatic feed control.
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