说明
无说明配置
Target wafer : Sapphire board (dia.25 ~ 150 / 80 ~ 500 μm) Tip size : Min 200 × 200 μm Y-axis stroke : 158 mm, Feed speed Max 200 mm/sec θ-axis stroke : 120° Feed rate Max 45°/sec Z-axis stroke : 30 mm, Feed rate Max 20 mm /sec Stage Size : DTF2-8-1/Mechanically fixed Ultra high/width : 160 mm /block width 2 mmOEM 型号描述
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DAITRON
DBM-602R
已验证
类别
Scribing, Cutting, Dicing
物品主要详细信息
状况:
Used
运行状况:
未知
产品编号:
51523
晶圆尺寸:
未知
年份:
2011
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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DBM-602R
已验证
类别
Scribing, Cutting, Dicing
上次验证: 60 多天前
物品主要详细信息
状况:
Used
运行状况:
未知
产品编号:
51523
晶圆尺寸:
未知
年份:
2011
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
Target wafer : Sapphire board (dia.25 ~ 150 / 80 ~ 500 μm) Tip size : Min 200 × 200 μm Y-axis stroke : 158 mm, Feed speed Max 200 mm/sec θ-axis stroke : 120° Feed rate Max 45°/sec Z-axis stroke : 30 mm, Feed rate Max 20 mm /sec Stage Size : DTF2-8-1/Mechanically fixed Ultra high/width : 160 mm /block width 2 mmOEM 型号描述
未提供文件
无文件