DISCO develops, manufactures, and sells precision machines and precision processing tools.

Amplifier of blade breakage detector, Amplifier of non-contact setup sensor

DISCO

DFD6360A

DAC550

DFD-2HSTI

DFD680

DAC-2SP/6

2000
New series dicing saws, DFD6350 and DFD6360, and new series grinder, DFG8540, developed.

DFD6350

The Disco-DFL7361 is a laser saw developed by Disco Corporation. It uses a processing method called Stealth Dicing, which focuses a laser within the workpiece to form a modified layer. Die separation is achieved with a tape expander. This method controls cutting waste because only a subsurface layer is processed, making it suitable for workpieces that are vulnerable to contamination.

DFL7361

The Disco DFD6561 Fully Automatic Dicing Saw is a space-saving solution for Φ300 mm dicing. It is equipped with uniquely developed short spindles and an optimized bridge-type frame structure resulting in a 16% reduced footprint. All maintenance can be performed from the front of the equipment, thus reducing the area needed for installation and maintenance areas by 20% (compared to the DFD6362).

DFD6561

The DFL7360FH is a laser saw from Disco Corporation. It is a dedicated tape frame transfer model that realizes high productivity for sapphire and MEMS processing and supports a variety of processes1. It uses Stealth Dicing, a processing method that focuses a laser within the workpiece to form a modified layer. Die separation is achieved with a tape expander2. This method controls cutting waste because only a subsurface layer is processed, making it suitable for workpieces that are vulnerable to contamination. It is also a dry process that does not require cleaning, suitable for applications (such as MEMS) that are vulnerable to mechanical load.

DFL7360FH

DFD690

DFD6860

DAD-2H/5

2017
Developed DFD6562, a small-footprint, fully automatic dicing saw that supports Φ300 mm wafers.

DFD6562

EAD 6750S

DAD685

2016
Developed DFD6310, a panel level packaging compatible dicing saw.

DFD6310

DFD-2HST

The DAC351 is a compact, automatic dicing/cutting saw manufactured by DISCO Corporation. It is designed for precision cutting work on materials such as magnetic heads for VCRs and computer disk drives, using 2-inch or 3-inch blades. The machine features a closed loop control system on the Y-axis and a cross roller bearing and ball screw movement on the Z-axis, which assures high precision and rigidity. The maximum workpiece handling size is 153 x 153 mm, and the maximum blade size is 76.2 mm. The machine is only 500 mm wide and is equipped with a 1.5 kW Synchro SpindleTM (air bearing spindle). It is ideal for applications that require precision cutting of magnetic heads for VCRs and computer disk drives.

DAC351

Disco’s laser application lineup supports miniaturized next generation devices. Providing the optimum ”Kiru” technology for various materials. Disco DAL7020 is an automatic equipment for ablation and is the smallest model for sapphire processing with workpiece size 150mm.

DAL7020

DAC750

The DAD3220 is an automatic dicing saw designed for compactness and compatible with 6 × 6-inch workpieces using a user-specified specification. It has a Φ150 mm single spindle and features an LCD touch panel with a graphical user interface for easy and intuitive operation.

DAD3220

DAC552

The DFM2800 is a fully automatic multifunction wafer mounter made by DISCO Corporation1. It is a specialized wafer mounter for inclusion in an inline system with a backgrinder to process Φ300 mm ultra-thin wafers. It mounts wafers that have been thinned with the DGP8761 system onto dicing tape or tape frames and removes the front side protection tape in a stable process.

DFM2800

DAC-2SP/86

Achieves high productivity for sapphire, lithium tantalate, and MEMS processing
Φ200 mm        Stealth Dicing™         SDBG         SDTT

DFL7341 is a fully automatic laser saw for Φ8-inch wafers which has seen wide used in applications such as LED sapphire substrates and silicon microphones.
Stealth Dicing™ process makes it possible for brittle materials such as SiC and GaN to be singulated without chipping.
This is a completely dry process, making it suitable for processing devices such as MEMS that are susceptible to water damage.

DFL7341

DAC350

DAD-2H/6TM

DAD-2H/5LI

DFD 6320

DAD-3S/8

DAD-2H/8

DAC770

The EAD695 is a jig-mounted dicing engine from DISCO that, when combined with an OEM customer’s handler, produces a CSP Singulation System. The engine is equipped with special CSP software containing various alignment methods. It offers advanced precision technology, excellent process performance, and a superior cutting finish. The system also boasts automatic alignment and workpiece handling, ease of operation and maintenance, and minimized cost of ownership. Its superior design and construction, as well as the use of quality components, ensure reliability.

EAD695

2017
Developed DFL7362, a stealth dicing laser saw that achieves higher throughput.

Laser saw compatible with various processes which achieves high-speed, high-quality processing of ultra-thin Si
Φ300 mm        Stealth Dicing™       SDBG       SDTT

DFL7362 is a fully-automatic laser saw for Φ300 mm wafers used mainly to singulate ultra-thin Si wafers.
Si with a thickness of 50 µm or less can be singulated at high speed while maintaining high die strength.
The equipment offers both wafer and frame transferring, making it possible to support a wide range of applications.

DFL7362

Discontinued 	Nov. 1996
up to 12 in wafer

DAD380

Φ6-inch ingot support laser saw for KABRA process

DAL7420

Fully automatic dicing saw with dual chuck tables
DFD6760 is a high end model which has further enhanced productivity from the existing model, DFD6362. Since this dicing saw has two chuck tables (hereafter called C/T), it is possible for transfer and alignment to occur on one chuck table, while processing is performed on the other chuck table. This shortens the spindle waiting time for processing considerably and improves productivity. In addition, inspection and measurement operations including processed workpiece image recording and workpiece thickness measurement using an NSD* can be performed on one chuck table, while processing proceeds on the other chuck table to maintain throughput. Increased X, Y and Z-axis feed speeds (same as the existing model) also contribute to the reduced processing time.

* Non-contact Surface Detector （option）

DFD6760

DFD-3S/8

DAC-4SPI/126

1978
World's first fully automatic dicing saw DFD-2H/S, developed.

DFD-2H/S

1975
Automatic Scriber/Dicing Saw DAD-2H developed and acclaimed a hit when exhibited at SEMICON West.

Discontinued 	Jan. 1978

DAD-2H

DAC-2SPH

Fully Automatic
Φ200 mm
Facing dual spindle

DFD6342

DFL7348

DAD690

2007
Developed the "DFL7340/7360" laser saws based on a business alliance with Hamamatsu Photonics

DFL7360

The DFD6363 is a flagship model for Φ300 mm wafers with high process extensibility. It is compatible with both frame and two-way (frame/wafer) transferring and supports various processes, including full cut and half cut, with only one DFD6363. This reduces size conversion operations and human error. It also supports both standard cassettes (Φ200 mm / Φ300 mm) and FOUP cassettes.

DFD6363

Fully automatic dicing saw with parallel dual spindles
Φ200 mm
Parallel dual spindle
Package Singulation

DFD6450

a laser saw which supports the KABRA processing of Φ8-inch wafers

DAL7440

DAD6450

Highly expandability to support various processing needs
Φ300 mm        Single spindle

Supports a wide range of applications
DAD3361 is a semi-automatic dicing saw capable of handling Φ300 mm workpieces.* A high-output 1.8 kW spindle is equipped as standard. By selecting a 2.2 kW high-torque, high-rigidity spindle (optional), it is possible to process silicon up to difficult-to-process materials, such as ceramic. Support for blades of up to Φ5 inches is possible with user-specified specifications. In addition, the alignment function for multiple-mounting workpieces to one table frame can be added an option.

* Supports jig tables with Φ395 mm or smaller circumscribed circles (user-specified specification).

DAD3361

DAD-3D/8

DAC-4SP/126

DAD520

DAD680

The EAD685 is a jig-mounted dicing engine from DISCO that is combined with an OEM customer’s handler to produce a CSP Singulation System. The dicing engine is equipped with special CSP software containing various alignment methods. The system offers advanced precision technology, excellent process performance, and a superior cutting finish. It also features automatic alignment and workpiece handling, ease of operation and maintenance, and minimized cost of ownership. The system is designed and constructed with superior quality components for reliability.

EAD685

DAD-2H/6M

DAC-2SP/65

The Disco DAD3350 is an automatic dicing saw that supports a wide range of applications. It is capable of handling a maximum of Φ8-inch or 250 x 250 mm workpieces (user-specified specification). A 1.8 kW spindle is equipped as standard. By selecting a 2.2 kW high-torque spindle (optional), it is possible to process silicon up to difficult-to-process materials, such as ceramic.

DAD3350

The DAD321 is an automatic dicing/cutting saw made by Disco Corporation. It is capable of handling wafers up to 6 inches in diameter and features an automatic theta rotation system. The unit is only 500mm wide and has a new 1.5kW SynchroSpindle that helps improve product quality.

DAD321

DFD651

The Disco DFD6340 is a Fully Automatic Dicing Saw that features a facing dual-spindle configuration with a shorter distance between blades, which improves throughput by up to 30% for step/bevel cut and 40% for dual cut when compared with parallel dual spindle dicing saws. It has the smallest footprint of any 8" saw in its class and utilizes an adjustable LCD touch screen graphical user interface making operation and maintenance intuitive and easy.

DFD6340

The Disco DFD641 has a maximum workpiece size of an ø8" wafer and is equipped with a 1.0 kW Synchro Spindle air bearing spindle. It can accommodate a maximum blade size of 61 mm and has a single spindle configuration. It also features enhanced productivity with automatic alignment and is suitable for semiconductor device applications.

DFD641

The DFL7160 is a fully automatic laser saw that is compatible with 300 mm wafers. It uses a pulse laser to achieve non-thermal processing and supports various applications, including full cut and DAF cut. This model has seen wide use in many applications such as GaAs full cut and DAF cut after DBG. To prevent wafer contamination from laser processing particles, the DFL7160 can be equipped with the HogoMax coating/cleaning mechanism, which is a water-soluble protective film that prevents laser processing particles from adhering to the wafer surface. This makes the DFL7160 a versatile and reliable tool for wafer processing.

DFL7160

Realizes a throughput improvement of approx 15% compared to the DAD321. Improved machine responsiveness with the latest CPU board. Also, improve feed speed of the spindle axis by refining the axis mechanism. Equipped with an auto alignment function, which has an established reputation in higher ranking models. Also, it employs a GUI to make screen operation easy. 14% smaller footprint compared to the DAD321.

DAD322

The DFL7341 is a fully automatic laser saw for Φ8-inch wafers which has seen wide use in applications such as LED sapphire substrates and silicon microphones. It uses a Stealth Dicing™ process that makes it possible for brittle materials such as SiC and GaN to be singulated without chipping.

DFL7340

The Disco DFD6361 is a Fully Automatic Dicing Saw. It offers highly consistent and dependable cut quality through the new Synchro Spindle featuring superior radial rigidity. The DFD6361 enhances throughput in two distinct ways: DISCO’s facing dual design and a reduction in distance between the blades help to control total cut time, while high-magnification microscopes (standard) and non-contact setup sensors (option) for both Z1 and Z2 reduce the time required for non-dicing sequences, such as kerf check and blade setup.

DFD6361

The DFD6360 workpiece has a maximum diameter of ø304.8 mm (ø12"). The air bearing spindle is a 1.0 kW Synchro Spindle and the maximum blade size is 61 mm. The spindle configuration is facing dual-spindles. The process method includes dual cut and step and bevel cut, which effectively reduces front and backside chipping and improves die strength. The graphical user interface allows for intuitive operation. This is suitable for applications such as semiconductor devices, ceramics, and glass.

DFD6360

Disco DAD341 dicing saw can accommodate 200mm wafers and features an automatic theta rotation system. In addition to the new 1.0kW *Synchro SpindleTM, a new 2.2kW *Synchro SpindleTM is available as an option, widening the range of applications by raising the unit's ability to handle large workpieces and hard-to-cut materials.

DAD341

The DFD6341 is a fully automatic dual spindle dicing saw for Φ8-inch wafers made by DISCO Corporation. It incorporates throughput enhancement technology developed in DFD6362 for Φ300 mm wafers and has a uniquely developed axis mechanism that enables X-axis return speeds up to 1,000 mm/s.

DFD6341

DFD640

The DFD6362 is a fully automatic dicing saw made by Disco Corporation. It is designed for improved productivity with Φ300 mm wafers and has a facing dual spindle. It offers higher dual cut processing speed due to the shortened distance between the spindles and various new functions.

DFD6362

EAD6340

DFD650

DFD641 has a maximum workpiece size of an ø8” wafer and features a 1.0 kW Synchro Spindle air bearing spindle. It can accommodate a maximum blade size of 61 mm and has a single spindle configuration. DFD641 also offers enhanced productivity through automatic alignment and is suitable for applications involving semiconductor devices."

DAD641

DAD691

Discontinued Apr. 1997
Up to 8inches wafer

DAD340

DAD522

The DAD320 is an automatic dicing saw developed in 1992.

DAD320

Simple and Compact Manual Dicing Saw Compatible with Φ8-inch Workpieces

High processability
Adoption of a 1.8 kW high-output spindle enables the processing of a wide range of materials from silicon to difficult-to-process materials like ceramics.

High maintainability
Built-in microscope with a lens shutter and scope blow function reduces maintenance frequency, which increases the utilization rate.

DAD3240

The 600 Series automatic dicing saws perform package singulation with custom jigs matched perfectly to the package substrate. The substrate is held in place by a vacuum, eliminating tape costs. After singulation, substrate waste is efficiently and effectively ejected from the dicer. Workpiece placement on the chuck table is manual, but alignment is automatic. An optional mechanical spindle supports multi-blade processing for higher throughput. The DAD695 has a max workpiece size of 250x250 and a maximum stroke of 30mm for the 1.0 kW air spindle and 40mm for the 2.2kW mechanical spindle.

DAD695

The DFD6240 is a Fully Automatic Dicing Saw developed by DISCO Corporation. It is among the world’s smallest single spindle dicing saws with a Φ200 mm Single spindle. The equipment is designed to reduce energy and air consumption, contributing to lower operation costs and environmental impact. It offers highly consistent and dependable cut quality through the new Synchro Spindle™ for superior radial rigidity.

DFD6240

2009
Introducing the DAD3650, the world's smallest dual-spindle automatic dicing saw.

Ultra compact dual-spindle automatic dicing saw

Small footprint
The optimal design of the DAD3650 combines high functionality and ultra compactness for a dual-spindle automatic dicing saw giving it a footprint 2/3 the size of the widely used single-spindle DAD3350 dicer for Φ8 inch wafers

DAD3650

Disco DFD681 can handle a workpiece size of up to ø8” wafer and has a 2.2 kW Synchro SpindleTM air bearing spindle. The maximum blade size is 76.2 mm and it has a single spindle configuration. It also has enhanced productivity with automatic alignment and can be used for applications such as cutting Quartz, glass, ceramics, Lithium Niobate, Lithium Tantalate and other hard-to-cut materials.

DFD681

EAD6750

The Disco DFD6750 is a Fully Automatic Dicing Saw that provides significantly raised productivity. It incorporates two chuck tables to enable one table to perform cutting while the other is simultaneously transferring, aligning, and cleaning. This results in a substantial reduction in spindle processing wait time for higher productivity.

DFD6750

EAD6361

DAD-2H/6

This dual dicer uses 1.0kW Synchro Spindles arranged in parallel to improve quality in step cutting and bevel cutting applications on workpieces up to ø203.2 mm (ø8") in diameter. It can handle a maximum blade size of 61 mm and is suitable for use on semiconductors, ceramics, and glass. The dual cut and step cut & bevel cut process methods effectively reduce front and backside chipping and improve die strength.

DAD651

DFD660

DAD381

DAD562

2017
Developed DFD6562, a small-footprint, fully automatic dicing saw that supports Φ300 mm wafers.

A space-saving solution for Φ300 mm dicing

16% reduced footprint
DFD6560 is equipped with uniquely developed short spindles and an optimized bridge-type frame structure resulting in a 16% reduced footprint. All maintenance can be performed from the front of the equipment, thus reducing the area needed for installation and maintenance areas by 20% (compared to the DFD6362). The DFD6560 is particularly ideal when installing multiple adjacent units.

DFD6560

DAD640

EAD 6340K

The DFL7560L is a fully-automatic laser lift-off machine for Φ6-inch wafers which achieves high processing speed and high processing quality using a DPSS (solid state) laser. It is manufactured by Disco Corporation. The maximum workpiece size is Φ300 mm and the processing range of the X-axis (Chuck table) is Φ310 mm with a moving speed of 1 ～ 600 mm/s.

DFL7560L

The DAD3231 is an Evolved Compact Dicing Saw designed by Disco Corporation for high performance and expandability. It has a Φ150 mm Single spindle and can satisfy a wide range of needs, including electronic component materials such as glasses and ceramics. The equipment layout was designed with additional space, so it can support workpieces up to 6 x 6 inches as an option.

DAD3231

DAD521

The Disco DAD3360 Automatic Dicing Saw is a Φ300 mm manual dicer that can meet a variety of needs. It offers exceptional processing flexibility while having an even more compact footprint than the existing DAD3350. Workpieces of sizes up to Φ300 mm are now supported and a high output 1.8 kW spindle is available as a standard option. The DAD3360 can cut not only silicon wafers but also products of a variety of sizes and materials such as large package substrates and electronic parts including SAW filters.

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

DISCO

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热门 DISCO Scribing, Cutting, Dicing

DFD680

DFD-2HSTI

DAC550

DAC-2SP/6

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