概述

This system is a device that converts scribed wafers into chips with break blades. Alignment is performed automatically by image processing. In addition, it is a fully automatic specification that automatically feeds wafers from a cassette containing rings. 1) General-purpose material wafer 2) Wafer size 8 inches or less　 3) Chip size 200 μm square or more Aspect ratio 1.5 or more 4) Workpiece mounting accuracy ±3 mm or less