Advantest offers solutions for a wide variety of semiconductors and test needs, from SoC and memory, to R&D evaluation and system level test.

Multi Vision Metrology Scanning Electron Microscope
In addition to its high-functionality CD-SEM features, the E3630 makes 3D imaging and measurement at the nanometer level, in real time and in a non-destructive way, possible. The E3630 significantly contributes to reducing TAT in R&D and production for many processes that require high-precision and/or 3D analysis.

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E3630

WAFER MVM-SEM E3310 - Multi Vision Metrology SEM supports next-generation wafers.
The E3310 is a WAFER MVM-SEM for next generation wafers, supporting 1Xnm node process development and volume production at the 22nm node and beyond. With its high-speed carrier system employing a dual arm vacuum robot, and low-vibration platform to improve measurement accuracy, the E3310 delivers high throughput and performance for wafer measurements. Its multi detector configuration and unique 3D measurement algorithm also enable stable, high-accuracy measurement of 3D transistor technologies such as FinFET. The E3310 makes a significant contribution to reducing process development turnaround time and improves productivity for next-generation devices.

E3310

Defect Review SEM supports next-generation photomasks
The E5610 is a MASK DR-SEM(Defect Review - Scanning Electron Microscope) for reviewing and classifying ultra-small defects in photomask and blanks.
Utilizing Advantest's highly stable, full automatic image capture technology, the E5610 easily imports defect location data from mask inspection systems and automatically images the locations. In addition, it features a newly developed EDS(Energy Dispersive X-ray Spectrometry) module that performs elemental analysis. With its high-accuracy, high-throughput defect review capability, the E5610 is expected to contribute to next-generation photomask production quality improvement and shorter manufacturing TAT.

E5610

The E3650 using Advantest's proprietary electron beam scanning technology, the new tool measures fine pattern dimensions on photomasks with higher precision and stability.The E3650 is the newest entry in the company's E3600 series, which has been widely accepted in the photomask SEM market. It enables measurement throughput to be doubled compared with the existing model, the E3640. E3650's higher throughput enables massive measurement required by more complex patterning and increased number of masks due to multiple patterning. In addition to leading-edge photomasks, the new tool also demonstrates superior performance when measuring EUV masks and master templates for nanoimprint applications.

E3650

Advantest's new E3640 Multi Vision Metrology Scanning Electron Microscope (MVM-SEM) tool supports pattern measurement for photomasks and other patterned media at dimensions as small as 1Xnm. A new entry in Advantest's widely-adopted E3600 Series of SEM systems, the E3640 delivers significantly improved measurement accuracy and higher throughput. Its industry-best pattern measurement capability supports the coming shift to the 1Xnm node for semiconductor volume production. In addition to photomasks for standard semiconductor lithography, the E3640 also offers enhanced metrology performance for EUV masks and NIL templates.

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