Designed, developed & manufactured high performance and precision chemical processing equipment. Products included electrochemical deposition systems for electroplating copper, gold, solder and other metals; surface preparation systems for cleaning, stripping and etching silicon wafers; and wafer transport container cleaning systems.

SEMITOOL

SST 302

Magnum® is a multimodule chemical processing platform that combines solvent, acid, and spin rinser/dryer capabilities into a single automated system. It is designed for high throughput production and has the flexibility for future expansion. The platform is capable of handling 150mm, 200mm, and 300mm wafers. Magnum® is used for wet cleaning and etching processes, including Pre-W-Silicide (HF Vapor), Pre-Salicide Clean, Metal etch, Pre-CVD clean, Pre-diffusion clean, Photoresist strip, Polymer removal, CMP clean, and Reclaim.

MAGNUM

The Spray Solvent Tool (SST) is a compact, efficient system that enhances chemical reactions on wafer surfaces. It employs mechanical and centrifugal forces to achieve uniform coverage on both sides of the wafer. The closed loop process control ensures consistent results, while continuous recycling and filtration of chemicals reduce waste. The SST offers precise temperature control and flexibility in chemical delivery methods. With its high throughput, small footprint, and operator safety features, it provides reliable and low-maintenance operation. The tool supports various processes, including GaAs clean, metal lift-off, photoresist removal, post-etch residue removal, and thin film heads. It utilizes technologies such as copper RDL and pillar structures. Flexibility - featuring two, four, or seven tank configuration in small footprint cabinet; process chambers, product carriers, and quick-disconnect rotors are available for wafers up to 200mm

SST 642

SST-C-621-280

SST-C-742-280

SST-421-280F

SST 772

SST 641

Millennium is a high-volume surface preparation system that incorporates spray, vapor, immersion, and rapid thermal anneal (RTA) technologies. It features high productive performance with six to ten processing chambers and one or two robots. The system utilizes Semitool’s Capsule™ technology for chemical delivery and surface tension gradient dry for advanced particle control. The chamber design can accommodate immersion, spray, vapor, or RTA processing. The system can increase productivity, reduce defect density, improve process control, reduce cycle time, and reduce cost of ownership. It has various applications including oxide etch, photoresist removal, post-CMP clean, pre-photo lithography clean, post-etch residue (polymer removal), back side metals clean, GaAs etch (gate recess etch), under bump metallurgy (UBM etch), pre-diffusion (pre-epi clean), pre-epi LTO oxide removal (bevels and face), pre-deposition (pre-gate clean), hydrOzone photoresist strip (post-ash), metal lift-off, Cu back side clean and bevel etch, back side films etch, fluorOzone clean, HF vapor etch.

MILLENNIUM

SST 408

C221280PB

SST 300

The Magnum 3000 designed for the new state-of-the-art 300mm wafer fabs currently planned by customers.


MAGNUM 3000

The Spray Acid Tool (SAT) is a versatile tool that offers a range of cleaning, etching, and stripping capabilities. It features a multichamber design that allows for safe and economical operation in a completely closed environment. The SAT is 300mm ready, meaning it can handle wafers of that size. Some of the specific applications of the SAT include post-CMP clean, photo-resist strip, polymer removal, pre-diffusion clean, monitor wafer clean, and metal etch. These processes are essential for the preparation and maintenance of semiconductor wafers during the manufacturing process.

The Spray Solvent Tool (SST) is a world standard in chemical stripping, developing, and cleaning technology. It has a multichamber capability and is 300mm ready. The SST can be used for a variety of processes, including developing, photoresist stripping, polymer removal, pre-metal deposition cleaning, and metal lift-off. This tool provides a versatile and efficient solution for a wide range of applications in the semiconductor industry.

EQ222SR

SST 742

SST-C-421-280

SST 441

Introduced to the market during fiscal 2002, the Sirius was designed specifically to deliver HydrOzone process. HydrOzone, using a minimal amount of deionized water and ozone is a low cost process option in comparison to the typical processes used for photoresist stripping, photolithography rework and organic cleans. The Sirius is a manually loaded semi-automated system with a 50 wafer capacity spray processing chamber. The system is available to accommodate either 200mm or 300mm wafer sizes.


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MAGNUM

SST 302

SST 642

SST-C-621-280

MAGNUM

SST 302

SST 642

SST-C-621-280

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