概述

Wafer Size: 300 mm, 200 mm Resolution: ≤1.50 µm Numerical Aperture (NA): 0.10 - 0.18 Reticle Size: 6 in. (0.25 in. thick) Reduction Ratio: 2:1 Field Size: 52 mm x 34 mm Overlay Accuracy: ≤300 nm (|m| + 3σ) frontside, ≤300 nm (|m| + 3σ) backside (option)