概述

The industry proven CLUSTERLINE® 300 is a flexible cluster platform allowing easy tool configuration with single process modules or unique batch sputter module technology. System Highlights Choose CLUSTERLINE® 300 for Wafer Level Packaging, Backside Metallization / Thin Wafer Processing and selected applications in Optoelectronics. -Integration of single process modules for PVD, highly ionized PVD, and Soft Etch -Thin wafer handling capability down to 300 μm and wafer bow up to 4mm; -200/300mm bridge or split tool compliant -New Degas and Artic dome etch technology for handling strongly outgassing organic substrates in WLP applications -Load Port Modules with 300mm FOUP load ports or open cassettes for 200mm -Wafer aligner for rotational pre-alignment (0.3°) and centering of wafers (0.05mm)