TELFORMULA is an advanced thermal processing system designed for the production of 65 to 45-nm-node-generation devices and beyond. It offers a reasonable Cost of Ownership (CoO), a short cycle time, and significantly improved process performance. Some of its key features include an ultra-clean, all-quartz reactor, state-of-the-art heater element technology, high-speed wafer-transfer robotics, and in-situ dry gas cleaning technology. TELFORMULA has a wide range of applications, including radical oxidation (LPRO), ultra-thin gate dielectrics formation (oxidation, nitridation), LPCVD (supporting Poly, Sin, SiO2 / Dry gas cleaning), ultra-low temperature LPCVD, and high-k film formation (AIO, HfO, AIO / HfO, HfSiO). With its advanced technology and versatile capabilities, TELFORMULA is an optimal choice for thermal processing in the semiconductor industry. 

TEL / TOKYO ELECTRON

TELFORMULA

E-Flux is an active temperature controller based on refrigeration cycle systems. It can precisely control the temperature during high-power IC testing. It is mainly used in engineering testing. It has a wide temperature range and can support up to 1,500W devices. The graphical user interface (GUI) supports RS-232 and Ethernet, allowing for remote control from a PC and reducing the testing time for on-site temperature regulation.

WINWAY

E-FLUX 4.0

Veeco Instruments Inc. a global leader of advanced thin film etch and deposition process equipment, acquired Ultratech, Inc. a leading supplier of lithography, laser-processing and inspection systems used to manufacture semiconductor devices and LEDs.


VEECO / ULTRATECH

LSA100A

Lam Research is a leading supplier of plasma etch- and single-wafer clean equipment that plays a pivotal role in defining the features and capabilities of next-generation semiconductor devices. With the addition of Novellus' innovative thin-film deposition and surface preparation product lines, the new Lam Research is well-positioned within the industry to support critical technology transitions including 3D structures in advanced logic and NAND memory, as well as the scaling to 450 mm wafers.

Thermal Processing

概述

服务

Thermal Processing 的制造商

Thermal Processing 的热门产品

TELFORMULA

E-FLUX 4.0

LSA100A

SOLA xT