概述

The UltraScan 9000 series of products are high throughput, in-line production systems that perform metrology and sorting at various stages of the wafer manufacturing and device fabrication processes. The 9300 and 9350 systems, introduced in 1990, employ the Company's E station measurement module to measure thickness down to an accuracy of 0.5 microns. The 9350 and 9650 systems have a smaller footprint than their larger counterparts, making them more suitable for applications in the device fabrication process, including photolithography, thermal processing, CMP and thin film deposition.