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The 9505-NT UltraGage characterizes thin-film stress and wafer shape for both patterned and monitor wafers. It provides fast, high-resolution measurements in two dimensions, and it correlates with x-ray diffraction, which is the only direct measure of thin film stress. It is not sensitive to film type, reflectivity or other optical reflections that may result from subsurface multi-layer stacks. An off-line software package enables the 9505-NT to measure both local and global stress.
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