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UltraMap-300IR
概述
Automated Wafer Thickness Measurement System IR interferometry probe technology. Single or dual probes. Thickness and shape measurement of wafers with backgrinding tape wafer on sawframe, dies on tape, wafer on bumps, SOI, multiple layers, bonded wafers, thickness of Si, plastic, glass, adhesive layers. Wafer 4" to 12" (100 to 300mm) round or square.
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