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说明
The FLX-2320 is a thin film stress machine. A laser scanner is used to measure the changes in the radius of curvature of the substrate caused by the deposition of a thin film on the wafer. This is accomplished by first measuring the wafer curvature before the film is deposited and then re-measuring the curvature after the film is deposited. A well-known mathematical relation is then used to calculate the stress of the thin film.配置
无配置OEM 型号描述
未提供文件
无文件
KLA
FLX 2320A
类别
Thin Film / Film Thickness
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
115322
晶圆尺寸：
未知
年份：
1993
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说明
The FLX-2320 is a thin film stress machine. A laser scanner is used to measure the changes in the radius of curvature of the substrate caused by the deposition of a thin film on the wafer. This is accomplished by first measuring the wafer curvature before the film is deposited and then re-measuring the curvature after the film is deposited. A well-known mathematical relation is then used to calculate the stress of the thin film.配置
无配置OEM 型号描述
未提供文件
无文件