概述

The KOBELCO SBW 330 is a wafer bow and warp measurement system designed for assessing the flatness and profile of silicon wafers used in semiconductor manufacturing. It measures parameters such as thickness, total thickness variation (TTV), bow, and warp, utilizing capacitive and optical sensors. The system accommodates wafer diameters ranging from 100 to 450 millimeters and offers high measurement accuracy and repeatability.