Onto Innovation is a worldwide leader in the design, development, manufacture and support of process control tools that perform macro defect inspections and metrology, lithography systems, and process control analytical software used by semiconductor wafer and advanced packaging device manufacturers. 

MetaPULSE 200 is the first production-worthy opaque film metrology tool that can simultaneously measure the individual thicknesses of up to six layers in a multi-layer metal (MLM) film stack. It can measure single or multi-layer thicknesses on product wafers with Angstrom accuracy and sub-Angstrom repeatability at up to 60 wafers per hour. The tool uses picosecond ultrasonic laser sonar (PULSE TechnologyTM), a non-contact, non-destructive measurement technique based on laser-induced ultrasound. Its pattern recognition allows it to reliably place its 10 µm measurement spot within existing metrology sites for reliable on-product measurement. MetaPULSE 200 can also diagnose film adhesion and interlayer-reaction problems, measure the RMS roughness of top- and buried-layers, and determine material properties such as silicide phase. This provides critical information about the product’s film stack, which is not available when using single-layer monitor wafer metrology. The system’s broad range of capabilities allows it to significantly reduce the use of monitor wafers in controlling cluster tool MLM deposition, leading to substantial cost and time savings.

ONTO / RUDOLPH / AUGUST

MetaPULSE 200

MetaPULSE 300 incorporates all of the features of our MetaPULSE 200 system and is configured to measure 300 millimeter product wafers.

MetaPULSE 300

MetaPULSE 200 XCu

MetaPULSE-III 300 XCu

MetaPULSE 300 XCu

MetaPULSE

MetaPULSE-III 300 is designed specifically to meet semiconductor manufacturers' metal thin-film metrology requirements at the 45 nm technology node and beyond. The modular design of the MetaPULSE-III offers Rudolph's patented PULSE Technology.

MetaPULSE-III 300

S300 Ultra-II

SONUS 7800

MetaPULSE-IIIa

MetaPULSE-II 200 XCu

MetaPULSE-II 300

These completely new second generation systems achieve higher throughput and better repeatability, especially when measuring copper interconnect structures in very low-k and ultra low-k interlevel dielectric.

ONTO / RUDOLPH / AUGUST

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热门 ONTO / RUDOLPH / AUGUST Thin Film / Film Thickness

MetaPULSE 200

MetaPULSE 300

MetaPULSE 200 XCu

MetaPULSE-III 300 XCu

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全部 ONTO / RUDOLPH / AUGUST Thin Film / Film Thickness