概述

The EVG520 HE is a cutting-edge semi-automated hot embossing system, specifically tailored for high-precision thermoplastic substrate imprinting. Capable of accommodating substrates up to 200 mm in diameter, it seamlessly integrates with industry-standard semiconductor manufacturing technologies. The system features high-vacuum and high-contact force capabilities, along with a universal embossing chamber, ensuring efficient and reliable processing. Its versatility allows for working with a comprehensive range of polymers suitable for hot embossing applications, making it an ideal choice for advanced manufacturing needs. Wafer Bonder