概述

SB6/8 Gen2 SUSS MicroTec provides a semi-automated platform for multiple bonding processes. Handling wafers up to 200mm as well as various shapes and types of substrates the SB6/8 Gen2 presents itself as a flexible tool for various applications and process environments. The SB6/8 Gen2 is suitable for packaging as well structuring meeting the requirements for MEMS, LED, advanced packaging, 2,5D integration, and 3D integration. SB6 Gen2 - from pieces up to 150mm wafers. Wafer Bonder