说明
GaN wafer grinding配置
无配置OEM 型号描述
The Disco DAG810 is a compact, automatic grinder for workpieces up to 8 inches in diameter. It has one spindle and one chuck table and is designed to process a variety of materials. It has a relatively small footprint of only 11 square feet.文件
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DISCO
DAG810
类别
Wafer Grinding
上次验证： 30 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
127548
晶圆尺寸：
未知
年份：
2023
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available