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说明
12" model was imported as a new machine. Later it was converted to 8" model. Now it is in operation as a Ф8" dedicated machine配置
无配置OEM 型号描述
The DISCO DFG8360 is a fully automatic in-feed surface grinder designed for precision thinning of semiconductor wafers. It features a two-spindle, two-chuck table configuration, enabling efficient grinding of wafers up to 8 inches in diameter. The grinder employs a diamond wheel with a diameter of 200 mm and operates with a spindle rated at 4.2 kW, offering a rotation speed range of 1,000 to 7,000 rpm. Its compact design measures 1,200 mm in width, 2,670 mm in depth, and 1,800 mm in height, with an approximate weight of 3,100 kg.文件
无文件
DISCO
DFG8360
类别
Wafer Grinding
上次验证： 30 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
120971
晶圆尺寸：
8"/200mm
年份：
2006
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说明
12" model was imported as a new machine. Later it was converted to 8" model. Now it is in operation as a Ф8" dedicated machine配置
无配置OEM 型号描述
The DISCO DFG8360 is a fully automatic in-feed surface grinder designed for precision thinning of semiconductor wafers. It features a two-spindle, two-chuck table configuration, enabling efficient grinding of wafers up to 8 inches in diameter. The grinder employs a diamond wheel with a diameter of 200 mm and operates with a spindle rated at 4.2 kW, offering a rotation speed range of 1,000 to 7,000 rpm. Its compact design measures 1,200 mm in width, 2,670 mm in depth, and 1,800 mm in height, with an approximate weight of 3,100 kg.文件
无文件