说明
无说明配置
Special config (frame handling, 6” dedicated chucks, 7.5kW spindles).OEM 型号描述
2011 Developed the DFG8830, a grinder with a 4-axis and 5-chuck table configuration for hard and brittle materials such as sapphire and SiC.文件
无文件
DISCO
DFG8830
类别
Wafer Grinding
上次验证： 16 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
128796
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
Special config (frame handling, 6” dedicated chucks, 7.5kW spindles).OEM 型号描述
2011 Developed the DFG8830, a grinder with a 4-axis and 5-chuck table configuration for hard and brittle materials such as sapphire and SiC.文件
无文件