说明
无说明配置
Vecco, VarianOEM 型号描述
The PRI Automation MagnaTran 8 QuadraFly is an advanced robotic system designed for high-precision wafer handling in a vacuum environment. It features SCARA arm technology and direct drive robotics, allowing the simultaneous exchange of four wafers within a compact swing diameter. The QuadraFly robot's patented tri-axial drive enables it to handle heavier payloads, making it suitable for various applications such as Flip Chip, WLCSP, BDA's, MEMS, GaAS, Laser Bars, and bare silicon. The direct magnetic drive technology enhances reliability by reducing the number of parts and eliminating the need for dynamic seals, leading to fewer failures and improved positional repeatability. This system offers efficient and precise wafer handling with minimized vibration, particle generation, and backlash, making it an ideal choice for semiconductor manufacturing processes.文件
无文件
BROOKS / PRI AUTOMATION
MAGNATRAN 8
已验证
类别
Wafer Handling
上次验证： 30 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
115919
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
BROOKS / PRI AUTOMATION
MAGNATRAN 8
类别
Wafer Handling
上次验证： 30 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
115919
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
Vecco, VarianOEM 型号描述
The PRI Automation MagnaTran 8 QuadraFly is an advanced robotic system designed for high-precision wafer handling in a vacuum environment. It features SCARA arm technology and direct drive robotics, allowing the simultaneous exchange of four wafers within a compact swing diameter. The QuadraFly robot's patented tri-axial drive enables it to handle heavier payloads, making it suitable for various applications such as Flip Chip, WLCSP, BDA's, MEMS, GaAS, Laser Bars, and bare silicon. The direct magnetic drive technology enhances reliability by reducing the number of parts and eliminating the need for dynamic seals, leading to fewer failures and improved positional repeatability. This system offers efficient and precise wafer handling with minimized vibration, particle generation, and backlash, making it an ideal choice for semiconductor manufacturing processes.文件
无文件