概述

The DISCO DFP8160 is a fully automatic dry polisher designed for stress relief on wafers up to 300 mm in diameter. It removes grinding-induced damage layers from wafer backsides without the use of slurry, chemicals, or water, thereby reducing wafer breakage and warpage while improving die strength and product yield. Additionally, its design allows integration with DISCO grinders, facilitating safer wafer handling in inline configurations.