High-throughput, high-resolution metrology for bonded stacks and single wafers.
The EVG50 (fully automated stand-alone tool) and the Inline Metrology Module (integrated in EVG's high-volume-manufacturing systems) offer highly accurate measurements at high speed, utilizing different measurement methods for a large number of applications. The tool's application range covers multi-layer thickness measurements for determination of the total thickness variation (TTV) of an intermediate layer, the inspection of bond interfaces as well as resist thickness measurement, and meets the most demanding requirements of the yield-driven semiconductor industry.

EV Group (EVG) is a leading supplier of high-volume production equipment and process solutions for the manufacture of semiconductors, MEMS, compound semiconductors, power devices and nanotechnology devices.
A recognized market and technology leader in wafer-level bonding and lithography for advanced packaging and nanotechnology, EVG’s key products include wafer bonding, thin-wafer processing and lithography/nanoimprint lithography (NIL) equipment, photoresist coaters, as well as cleaning and inspection/metrology systems.

EVGroup (EVG)

EVG50

Replaced by Model 8810
The 3800 OEM gaging module is a non-contact capacitive dimensional gaging system designed for maximum flexibility combined with ease of use.  Capacitive transduction converts variations in a probe-to-target distance into an electrical signal.

MicroSense has a singular focus on precision measurement. Provide customers with state-of-the-art measurement performance products - precision capacitive sensors for high resolution, non-contact position sensing; vibrating sample magnetometers and MOKE systems for magnetic property measurement; and wafer metrology systems for accurately measuring wafer thickness and shape.

KLA / MICROSENSE

3800

EVG 20 IR Inspection System (stand-alone tool) Infrared Inspection Station (integrated module) 
The EVG20 offers a fast inspection method, especially for fusion bonded wafers. A live image of the entire wafer via IR transmission allows void detection down to a radius of 500 µm which is a perfect match for fusion bonding processes.  In addition, the infrared inspection system supports bond strength measurements using the Maszara method.

EVG20

The Model 6810 high resolution capacitive sensor offers state-of-the art performance for position and displacement measurement. The 6810 is designed specifically for "high dynamic" measurement of high speed rotating or oscillating targets such as precision Hard Disk Drive spindle motors, precision air bearing spindles and mechanical bearing machine tool spindles.  Applications include run out measurement such as axial and radial NRRO (non-repeatable run out or asychronous error motion) which require resolution of 1 to 2 nm-rms or better.

The 6810 is electrically compatible “drop in” replacement for users who wish to upgrade from existing 5810 systems – no design changes are required.
 
The 6810 is ideal for use with our SpinCheck Metrology System – The 6810 is 100% compatible with existing and new SpinCheck systems. Existing SpinCheck customers can typically improve measurement resolution by 2X to 5X by upgrading to 6810 demodulators modules and 6000 series probes.

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

Wafer Testing

概述

服务

Wafer Testing 的制造商

Wafer Testing 的热门产品

EVG50

3800

EVG20

6810