The SEZ 323 is a spin-processing system designed for high throughput cleaning and film removal applications for 300 mm semiconductor wafer processing. It has a robot on a linear tracking system that transports wafers from four cassettes to two identical process chambers that can apply up to three chemicals each. The system has a SEMATECH-compliant graphical user interface and touch screen, and offers options such as a retrofit kit for processing 200 mm wafers, a rinse and dry module, endpoint detection, and more. It supports applications such as cleaning, etching, backside etch & clean, silicon substrate etch, and wafer reclaim.

Lam Research Corporation acquired SEZ Group, the leading supplier of single-wafer clean technology and products to the global semiconductor manufacturing industry.

LAM RESEARCH / SEZ

SP323

LAM RESEARCH CORPORATION

The DV-34BF is part of the Da Vinci Series, a single-wafer processing technology platform designed for high-volume manufacturing. It addresses new cleaning requirements for polymer removal and backside etch and clean, providing high-throughput and accurate wafer cleaning to maximize device yields. The four-chamber system performs a wide range of back-and frontside processes on 300 mm wafers and is optimized for emerging technologies such as high-k dielectrics, new metal gates, and non-volatile memory devices. It offers optimized process performance, high throughput, minimized footprint, advanced handling, reduced media consumption, flexible chemistry application, higher reliability, resulting in low CoO.

Wet Etch

概述

服务

Wet Etch 的制造商

Wet Etch 的热门产品

SP323

EOS

DV-34BF

CELLESTA +