说明
无说明配置
Config: 2f2d Chamber A Process : Wafer surface clean Chuck : Vacuum Chuck SPRAY : Soft Spray N2 10~100NL/min Rinse :DIW/ CO2 INJENCTION ,resistivity <1MΩ Spin DRY : 3000rpm Spin Dry only Chamber B Process : Wafer surface clean Chuck : Vacuum Chuck SPRAY : Soft Spray N2 10~100NL/min Rinse :DIW/ CO2 INJENCTION ,resistivity <1MΩ Spin DRY : 3000rpm Spin Dry only Chamber C Process : Wafer Backside clean Chuck : Mechanical Chuck SPRAY : Soft Spray N2 10~200NL/min Burush : PVA Burush Rinse :DIW/ CO2 INJENCTION ,resistivity <1MΩ Spin DRY : 2400rpm Spin Dry only Chamber D Process : Wafer Backside clean Chuck : Mechanical Chuck SPRAY : Soft Spray N2 10~200NL/min Burush : PVA Burush Rinse :DIW/ CO2 INJENCTION ,resistivity <1MΩ Spin DRY : 2400rpm Spin Dry only Software Version (include revision #) V242B000 System Power Rating 208AC 3-phase (eg. 110 AC 3-Phase for System) Loading Configuration 3 load ports (eg. 6 load positions for furnace or dual auto-indexer loaders) Process Modules Qty. 1 Loadport Qty 3 Power supply unit Qty 1 Vendor Chm Model Chemicals / Gases Used (not to use Micron Proprietary names) U03 SS(Surface) CO2Water U04 SS(Surface) CO2Water U05 SSR(Backside) CO2Water U06 SSR(Backside) CO2WaterOEM 型号描述
Wafer Scrubber文件
无文件
SCREEN / DNS / DAINIPPON SCREEN
SS-3000-AR
已验证
类别
Wet processing
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
47696
晶圆尺寸：
12"/300mm
年份：
2005
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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SCREEN / DNS / DAINIPPON SCREEN
SS-3000-AR
已验证
类别
Wet processing
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
47696
晶圆尺寸：
12"/300mm
年份：
2005
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
Config: 2f2d Chamber A Process : Wafer surface clean Chuck : Vacuum Chuck SPRAY : Soft Spray N2 10~100NL/min Rinse :DIW/ CO2 INJENCTION ,resistivity <1MΩ Spin DRY : 3000rpm Spin Dry only Chamber B Process : Wafer surface clean Chuck : Vacuum Chuck SPRAY : Soft Spray N2 10~100NL/min Rinse :DIW/ CO2 INJENCTION ,resistivity <1MΩ Spin DRY : 3000rpm Spin Dry only Chamber C Process : Wafer Backside clean Chuck : Mechanical Chuck SPRAY : Soft Spray N2 10~200NL/min Burush : PVA Burush Rinse :DIW/ CO2 INJENCTION ,resistivity <1MΩ Spin DRY : 2400rpm Spin Dry only Chamber D Process : Wafer Backside clean Chuck : Mechanical Chuck SPRAY : Soft Spray N2 10~200NL/min Burush : PVA Burush Rinse :DIW/ CO2 INJENCTION ,resistivity <1MΩ Spin DRY : 2400rpm Spin Dry only Software Version (include revision #) V242B000 System Power Rating 208AC 3-phase (eg. 110 AC 3-Phase for System) Loading Configuration 3 load ports (eg. 6 load positions for furnace or dual auto-indexer loaders) Process Modules Qty. 1 Loadport Qty 3 Power supply unit Qty 1 Vendor Chm Model Chemicals / Gases Used (not to use Micron Proprietary names) U03 SS(Surface) CO2Water U04 SS(Surface) CO2Water U05 SSR(Backside) CO2Water U06 SSR(Backside) CO2WaterOEM 型号描述
Wafer Scrubber文件
无文件