V3 Compact Batch Immersion System offering either dry-to-dry or dry-to-wet processing with low exhaust requirements, few facility connections and easy maintenance access, while maintaining as much as a 20 percent footprint reduction over comparable tool sets. The V3 robot is designed to accommodate 150 mm or 200 mm wafers in standard cassettes for IC devices; alternate cassettes allow other materials to be processed using the standard robot arm. Suitable for R&D labs and applications.

Akrion focuses on multiple wet process solutions for semiconductor applications where high yield and low cost of ownership is a challenge. Each process step in device manufacturing presents an opportunity for contamination, which can result in defect formation and device failure, therefore critical cleaning is an integral part of our equipment’s capabilities.

V3

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