The ASMPT EAGLE XTREME is an advanced semiconductor die bonder developed by ASM Pacific Technology (ASMPT), a leading supplier of semiconductor assembly and packaging equipment. The EAGLE XTREME is designed to provide high-precision die bonding capabilities for semiconductor manufacturing processes.

ASM is a supplier of semiconductor process equipment for wafer processing, including lithography, deposition, ion implant and single-wafer epitaxy. ASM is part of the ASM International NV group that also includes ASM Pacific Technology (ASMPT). ASMPT, in which ASMI holds a substantial ownership is a leading supplier of semiconductor process equipment for wafer assembly and packaging, and for surface mount technology.



EAGLE XTREME

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Introducing the new revolutionary high speed Eagle Xtreme wire bonder specifically designed to cater to the industry’s increasing advanced wire bonding applications. Eagle Xtreme features an ultra-light digital bond head and Dual Coil Linear Motor XY table for high speed bonding. High position and force control resolution gives unprecedented performance in ultra-fine pitch bonding. Fully programmable work holder and indexer system coupled with Windows based operating system provides a user friendly interface for easy setup and conversion.


6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

EAGLE XTREME

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