概述

"Introducing the Model 360 large wire bonder, a cutting-edge system designed to enhance your productivity. With an impressive bonding rate of 70 bonds per minute, it outperforms previous systems by increasing throughput by 25%. Despite its powerful capabilities, this wire bonder boasts compact dimensions, measuring only 60cm (W) x 105cm (D) x 182cm (H). Equipped with a deep access bond head and an exclusive pattern recognition system, the Model 360C system automates the bonding process for a wide range of electronic packages. Whether you require aluminum or copper wire measuring 125 to 650 um, this system has you covered. Thanks to its computer-controlled four-axis bond head, you can easily bond various types of modules, lead frames, and hybrid substrates. The travel lengths are 6 inches (x direction), 10 inches (Y direction), and 2 inches (Z direction), ensuring flexibility in your bonding operations. Furthermore, the Model 360 large wire bonder ensures exceptional precision, with bond head positioning accuracy within 1um. Trust in this advanced system to optimize your productivity and streamline your electronic bonding tasks."