说明
W/B TX04-044 WB308配置
无配置OEM 型号描述
The ASM Twin Eagle Xtreme is an advanced wedge bonder that offers enhanced capabilities compared to the standard Xtreme model, delivering higher output per floor space. It is specifically designed to cater to the consumer products market by providing fast and flexible solutions at a cost-effective level. This system is equipped to handle flip chip processes, allowing for the application of gold or copper stud bumps on wafers up to 300mm in diameter. With its improved speed and versatility, the Twin Eagle Xtreme is a valuable tool for meeting the demands of modern semiconductor manufacturing.文件
无文件
类别
Wire / Wedge / Ball Bonder
上次验证： 12 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
128643
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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ASM
TWIN EAGLE XTREME
类别
Wire / Wedge / Ball Bonder
上次验证： 12 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
128643
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
W/B TX04-044 WB308配置
无配置OEM 型号描述
The ASM Twin Eagle Xtreme is an advanced wedge bonder that offers enhanced capabilities compared to the standard Xtreme model, delivering higher output per floor space. It is specifically designed to cater to the consumer products market by providing fast and flexible solutions at a cost-effective level. This system is equipped to handle flip chip processes, allowing for the application of gold or copper stud bumps on wafers up to 300mm in diameter. With its improved speed and versatility, the Twin Eagle Xtreme is a valuable tool for meeting the demands of modern semiconductor manufacturing.文件
无文件